Saturday, April 23, 2011

Electrical Engineering Preliminary

Electrical Engineering Preliminary Exam Syllabus
 Electrical Circuits-Theory and Applications: Circuit components, network graphs, KCL,KVL; circuit analysis methods: nodal analysis, mesh analysis; basic network theorems and application transient analysis:RL ,RC and RLC circuits; sinusoidal steady state analysis; resonant circuits and applications; coupled circuits and applications; balanced 3-phase circuits. Two port networks, driving point and transfer functions; poles and zeros of network functions.
Signals& Systems: Representation of continuous-time and discrete –time signals & system’s; LTI systems; convolution; impulse response; time –domain analysis of LTI system based on convolution differential/difference equation. Fourier transform, Laplace transform, Z-transform, Transfer function. Sampling and recovery of singles.
Control Systems: Elements of control systems; block-diagram representations; open-loop & close loop systems; principles and applications of feedback.LTI systems time domain and transform doma analysis.Stability: Routh Hurwitz criterion, root-loci Nyquist’s criterion.Bode-plots, Design of lead- lag compensators; Proportional, PI, PID controllers.
E.M.Theory: Electrostatic and magneto static field; Maxwell’s equations; e.m. waves and wave equations; wave propagation and antennas; transmission lines; micro-wave resonators. Cavities and wave guides.
 Electrical Engineering Materials: Electrical/electronic bahaviour of materials: Conductivity; free electrons and band-theory; intrinsic and extrinsic semi-conductor, p-n junction; solar cells, super conductivity, Dielectric behavior of materials: polarization phenomena; piezo-electric phenoment Magnetic materials: behavior and application
Analog Electronics: Diode circuits: rectifiers, filters, clipping and clamping, zener diode and voltage regulation. Bipolar and field effect transistors (BJT,JEET and MOSFET):characteristics, biasing and small signal equivalent circuits. Basic amplifier circuits; differential amplifier circuits. Amplifiers analysis, frequency response. Principle of feedback; OP AMP circuits; filters; oscillators.
Digital electronics: Boolean algebra; minimization of Boolean function; logic gates, digital IC families (DTL, TTL, ECL, MOS, CMOS). Combinational circuits: Arithmetic circuits, code converters, multiplexers and decoder’s Sequential circuits: latches and flip-flops, counters and shift-registers Comparators, timers, multivibrators. Sample and hold circuits; ADCs and DACs. Semiconductor memories.
Communication System: Fourier analysis of signals: amplitude, phase and power spectrum, auto correlation and cross-correlation and their Fourier transforms. Analog modulation systems: amplitude and angle modulation and demodulation systems, spectral analysis; superheterodyne receivers, pulse code modulation (PCM) , differential PCM , delta modulation. Digital modulation schemes: amplitude phase and frequency shift keying scheme (ASK, PSK, FSK) .Multiplexing: time-division, frequency division. Additive Gaussian noise: characterization using correlation, probability density function, power spectral density, Signal-to-noise ratio calculations for AM and FM Elements of digital communication systems:sourcecoding, channel coding; digital modulation & demodulation .Elements of Information theory, channel capacity. Elements of satellite and mobile communication; principles of television engineering; radar engineering and radio aids to navigations
Computers and Microprocessors: Computer organization: number representation and arithmetic functional organization, machine instructions, addressing modes, ALU, hardwired and Micro programmed control memory organization. Elements of microprocessors:8-bit microprocessors-architecture instruction set, assembly level programming , memory,1/0 interfacing, microcontrollers and application
Measurement and Instruments:  Error analysis ;,measurement of current voltage, power, energy power-fact, resistance, inductance,caoacitance and frequency; bridge mesurenebts.Electronic measuring instruments: multimeter,CRO digital coltmeter,frequency counter, Q-meter, spectrum analyser, distortion-meter.Transdcers:thermocouple, thermistor,LVDT, strain-gauges, piezo-electric crystal. Use of transducers in measurement of non-electrical quantities. Data-acquisition systems.
 Energy Conversion: Singlepphase transformer: equivalent circuit, phasor-diagram, tests regulation and efficiency; three-phase transformer, auto transformer. Principles of energy conversion-d.c.generatiors and motors: Performers characteristics, starting and speed control armature reaction and commutation three-phase induction motor; performance characteristics, starting and speed control. Single-phase induction motot.Synchronous generators: performance characteristics, regulation, parallel operation. Synchronous motors: starting characteristics, applications; synchronous condenser.FHP motors, permanent magnet and stepper motors, brushless d.c. motors, single –phase motors.
Power systems: Electric power generation: thermal, hydro, nuclear. Transmission line parameters: steady-state performance of overhead transmission lines and cables. Distribution systems: insulators, bundle conductors, corona and radio interference effect; per-unit quantities; bus admittance and impedance matrices; load flow; voltage control and power correction. Economic operation. Principles of over current, differential and distance protection; solid state relays, circuit breakers, concept of system stability.HVDC transmission.
 Power Electronics and Electric Drives: Semiconductor power devices: diode, transistor, thruster, triac,GTO and MOSFET, static characteristics, principles of operation; triggering circuits; phase controlled rectifiers; bridge converters-fully controlled and held controlled, principles of thruster chopper and inverter. Basic concept of speed control of DC and AC motor drives
Elements of IC Fabrication Technology: Overview of IC Technology. Unit steps used in IC fabrication: water cleaning, photo-lithography, wet and dry etching, oxidation, diffusion, ion-implantation, and CVD and LPCVD techniques for deposition of poly-silicon, silicon, silicon-nitride and silicon dioxide; metallization and passivation.

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